eVehicle Technology
Vitesco Technologies, a prominent global provider of cutting-edge drive technologies and electrification solutions, is developing a power module which will be manufactured using transfer molding process. This manufacturing process involves encapsulating power electronics within a dielectric material, offering exceptional protection for the components. The result is a very robust, cost effective and reliable electronic. This power module comprises three overmolded half-bridges and serves as the central component of an inverter system. This system plays a pivotal role in managing both the propulsion and energy recovery (recuperation) aspects of high-voltage electric vehicles.
Manufactured at the Nuremberg electronics plant, the power modules will be delivered to a large global car maker from mid-2025 onwards.
Vitesco Technologies has been adapting and utilizing transfer molding technology since 2020, first applying it to compact Transmission Control Units designed for full integration inside a gear box.
The overmold power modules now combine highly efficient state-of-the art silicon carbide (SiC) chip technology with overmolding to facilitate a particularly robust product with increased power density, lower cost and reduced weight.
Thomas Stierle, member of the board and head of Vitesco Technologies’ Electrification Solutions division, said “These power modules are a good example of our strategic approach of using the scalability and modularity of our power electronics to develop and manufacture submodules in addition to the complete electronics. Combined with our extensive overmolding expertise, we can deliver an extremely robust product to our customers. This is yet another example of how we successfully transfer proven technology to an electrification product.”
Vitesco Technologies has extensive expertise in power electronics and is already on the market with its fourth generation. The newly developed overmold power module expands the company’s strategic portfolio.
“A very deep system competence is necessary to ensure that a sub-module of this kind, which forms the core of the inverter, can be successfully integrated into the full system. Our degree of electronics modularity and scalability enables us to offer more flexibility in terms of customer-specific interfaces,” explained Michael Horbel, head of product and platform management high voltage inverter.
Vitesco Technologies will continue to use this strength to bring further electronic sub-modules to the market.
The lead plant for these modules is Vitesco Technologies’ Nuremberg site. With its existing competencies and experience, the plant offers a high degree of automation as well as the focus on electronics and e-mobility required for the power modules. This is a further step forward into the “Plant of the Future” concept, defined for the Nuremberg plant to maintain its international competitiveness.
SOURCE: Vitesco Technologies
